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Proceedings of the Estonian Academy of Sciences

ISSN 1736-7530 (electronic)   ISSN 1736-6046 (print)
Formerly: Proceedings of the Estonian Academy of Sciences, series Physics & Mathematics and  Chemistry
Published since 1952

Proceedings of the Estonian Academy of Sciences

ISSN 1736-7530 (electronic)   ISSN 1736-6046 (print)
Formerly: Proceedings of the Estonian Academy of Sciences, series Physics & Mathematics and  Chemistry
Published since 1952
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Mechanical and thermal properties of epoxy composite thermal insulators filled with silica aerogel and hollow glass microspheres; pp. 339–346

(Full article in PDF format) https://doi.org/10.3176/proc.2017.4.03


Authors

Mikk Vahtrus, Sven Oras, Mikk Antsov, Valter Reedo, Uno Mäeorg, Ants Lõhmus, Kristjan Saal, Rünno Lõhmus

Abstract

Hydrophobic silica aerogel powder and hollow glass microspheres (HGM) were used as fillers for an epoxy adhesive to improve its thermal insulator properties. At 50 wt% of HGM content, the thermal conductivity of the HGM/epoxy composite decreased from 0.182 W/m·K to 0.104 W/m·K. The aerogel/epoxy composite, on the contrary, showed a slight increase in its thermal conductivity, most probably due to the filling of aerogel pores with the epoxy adhesive. Furthermore, it was shown that adhesion values of epoxy composites increase with the addition of aerogel and decrease when HGM was used as the filler material. Realistic numerical finite element method simulations revealed an increase in thermal isolation properties for both HGM/epoxy and aerogel/epoxy composites.

Keywords

thermal insulator, epoxy composite, aerogel, hollow glass microspheres, adhesion, polymer testing methods and devices, finite element method.

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Current Issue: Vol. 67, Issue 4 in Press, 2018




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No. 1: 20 March
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